Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings
- 期刊名称Journal of Vacuum Science and Technology
- 作者Thornton, John A.
- 卷第12卷
- 期第4期
- 印刷ISSN0022-5355
- 文件大小1795.86KB
- 发表时间1975-7
- DOI10.1116/1.568682
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