The plaque-inhibiting effect of copper amalgam
- 作者Tuula Hyyppä; Keuo Paunio
- 卷第4卷
- 期第4期
- 印刷ISSN0303-6979
- 电子ISSN1600-051X
- 文件大小2765.19KB
- 发表时间1977
- DOI10.1111/j.1600-051x.1977.tb01895.x
- 页码231-239
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