[IEEE 20th International Reliability Physics Symposium - San Diego, NV, USa (1982.03.30-1982.04.1)] 20th International Reliability Physics Symposium - A Rapid Technique of Evaluating Thermally Induced Strains in Leadless Ceramic Chip Carriers Mounted to Polymeric Substrates
- 作者DerMarderosian, Aaron; Nadeau, Roger; Gionet, Vincent
- 文件大小4778.44KB
- 发表时间1982
- DOI10.1109/irps.1982.363015
- 页码1-5
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