![[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Modeling and analysis of electrothermal effects on global ULSI interconnects]()
[IEEE 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Singapore, Singapore (2010.12.7-2010.12.9)] 2010 IEEE Electrical Design of Advanced Package & Systems Symposium - Modeling and analysis of electrothermal effects on global ULSI interconnectsLi, Xiaochun; Tong, Jialing; Shao, Yan; Mao, Junfa · 2010