![[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of the grain boundary on the dielectric breakdown strength of (Ba<inf>0.4</inf>Sr<inf>0.6</inf>)TiO<inf>3</inf> paraelectric ceramics with various grain sizes]()
[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of the grain boundary on the dielectric breakdown strength of (Ba<inf>0.4</inf>Sr<inf>0.6</inf>)TiO<inf>3</inf> paraelectric ceramics with various grain sizesSong, Zhe; Liu, Hanxing; Hao, Hua; Cao, Minghe; Xu, Qing; Yao, Zhonghua; Wang, Zhijian; Hu, Wei; Shi, Yatong; Yu, Zhiyong · 2014