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Comparative Studies of Vibrational Reliability of Electroconductive Adhesive and Soldered Microjoints

Comparative Studies of Vibrational Reliability of Electroconductive Adhesive and Soldered Microjoints

Rawicz, Andrew H.

作者Rawicz, Andrew H.
期第5期
印刷ISSN0018-9529
电子ISSN1558-1721
文件大小1227.73KB
发表时间1987
DOI10.1109/tr.1987.5222463

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