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On the stress measurement method using grain growth process of electrodeposited copper foil. (1st report Grain nucleation and grain growth)

On the stress measurement method using grain growth process of electrodeposited copper foil. (1st report Grain nucleation and grain growth)

KITAOKA, Seiichiro; KOBAYASHI, Toshihiro; OHSHIMA, Kazuhiko; MIKURIYA, Teruaki
  • 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
  • 作者KITAOKA, Seiichiro; KOBAYASHI, Toshihiro; OHSHIMA, Kazuhiko; MIKURIYA, Teruaki
  • 卷第53卷
  • 期第487期
  • 印刷ISSN0387-5008
  • 电子ISSN1884-8338
  • 文件大小965.11KB
  • 发表时间1987
  • DOI10.1299/kikaia.53.646
  • 页码646-652
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