![[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive]()
[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesiveTolvgard, A.; Malmodin, J.; Liu, J.; Lai, Z. · 1998