Epoxy-glass integrated circuit package having bonding pads in a stepped cavity: McNeal, N.E., Nagy, R.A. and Norell, R.A. (Burroughs Corporation, Detroit, MI, USA) US Pat 4 643 935 (17 February 1987)

• 卷第19卷
• 期第1期
• 印刷ISSN0010-4361
• 文件大小147.59KB
• 发表时间1988
• DOI10.1016/0010-4361(88)90667-2