[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Enhanced high performance reliable AlSi/TiW metallization for 1.0 mu m CMOS process
- 作者Chou, H.M.; Su, W.D.; Liou, J.C.; Shiue, R.Y.; Tuan, H.C.
- 文件大小58.28KB
- 发表时间1989
- DOI10.1109/vmic.1989.78061
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