[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Polyimides for Dielectric Layers
- 作者Lupinski, John H.; Moore, Robert S.
- 文件大小787.64KB
- 发表时间1989
- DOI10.1021/bk-1989-0407.ch011
- 页码127-139
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