发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

On the Stress Measurement Method Using the Grain Growth Process of Electrodeposited Copper Foil : 3rd Report, Adaptation of Stress Measurement Method to Low Temperatures Using Grain Growth Rate

On the Stress Measurement Method Using the Grain Growth Process of Electrodeposited Copper Foil : 3rd Report, Adaptation of Stress Measurement Method to Low Temperatures Using Grain Growth Rate

KITAOKA, Seiichiro; OHSHIMA, Kazuhiko
  • 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
  • 作者KITAOKA, Seiichiro; OHSHIMA, Kazuhiko
  • 卷第55卷
  • 期第520期
  • 印刷ISSN0387-5008
  • 电子ISSN1884-8338
  • 文件大小697.21KB
  • 发表时间1989
  • DOI10.1299/kikaia.55.2503
  • 页码2503-2509
← 返回【学霸图书馆】主页