Deformation in Multilayer Stacked Assemblies
- 期刊名称Journal of Electronic Packaging
- 作者Pan, Tsung-Yu; Pao, Yi-Hsin
- 卷第112卷
- 期第1期
- 印刷ISSN1043-7398
- 文件大小449.19KB
- 发表时间1990
- DOI10.1115/1.2904337
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