SPIE Proceedings [SPIE Fibers '91, Boston, MA - Boston, MA (Tuesday 3 September 1991)] Microelectronic Interconnects and Packages: Optical and Electrical Technologies - Application of electrodeposition processes to advanced package fabrication

Krongelb, Sol; Dukovic, John O.; Komsa, M. L.; Mehdizadeh, S.; Romankiw, Lubomyr T.; Andricacos, Panayotis C.; Pfeiffer, A. T.; Wong, Kason; Arjavalingam, Gnanalingam; Pazaris, James

作者Krongelb, Sol; Dukovic, John O.; Komsa, M. L.; Mehdizadeh, S.; Romankiw, Lubomyr T.; Andricacos, Panayotis C.; Pfeiffer, A. T.; Wong, Kason; Arjavalingam, Gnanalingam; Pazaris, James
卷第1389卷
印刷ISSN0277-786X
文件大小641.54KB
发表时间1991
DOI10.1117/12.25527
页码249-256

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SPIE Proceedings [SPIE Fibers '91, Boston, MA - Boston, MA (Tuesday 3 September 1991)] Microelectronic Interconnects and Packages: Optical and Electrical Technologies - Application of electrodeposition processes to advanced package fabrication