Electromigration characteristics of copper interconnects
- 期刊名称IEEE Electron Device Letters
- 作者Tao, J.; Cheung, N.W.; Hu, C.
- 卷第14卷
- 期第5期
- 印刷ISSN0741-3106
- 电子ISSN1558-0563
- 文件大小250.30KB
- 发表时间1993-05
- DOI10.1109/55.215183
- 页码249-251
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