Small Diameter Dry Etched Via Holes in GaAs
- 期刊名称MRS Proceedings
- 作者Pearton, S. J.; Ren, F.; Katz, A.; Tseng, B.; Lothian, J. R.; Fullowan, T. R.
- 卷第300卷
- 电子ISSN1946-4274
- 文件大小1858.03KB
- 发表时间1993-1
- DOI10.1557/proc-300-153
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