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Automated inspection of through hole solder joints utilizing X-ray imaging

Automated inspection of through hole solder joints utilizing X-ray imaging

B. Pierce; D. Shelton; H. Longbotham; S. Baddipudi; Ping Yan

作者B. Pierce; D. Shelton; H. Longbotham; S. Baddipudi; Ping Yan
卷第9卷
期第2期
文件大小416.65KB
发表时间1994
DOI10.1109/62.260040
页码28-32

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