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[IEEE Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Windsor, England (8-10 June 1994)] Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chips

[IEEE Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Windsor, England (8-10 June 1994)] Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chips

Barrett, J.; Cahill, C.; Compagno, T.; O'Flaherty, M.; Hayes, T.; Lawton, W.; O'Donavan, J.; McCarthy, G.; Slattery, O.; Waldron, F.; Vera, A.C.; Masgrangeas, M.; Val, C.; Drouhin, I.
  • 作者Barrett, J.; Cahill, C.; Compagno, T.; O'Flaherty, M.; Hayes, T.; Lawton, W.; O'Donavan, J.; McCarthy, G.; Slattery, O.; Waldron, F.; Vera, A.C.; Masgrangeas, M.; Val, C.; Drouhin, I.
  • 文件大小167.97KB
  • 发表时间1994
  • DOI10.1109/wptmt.1994.763544
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