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[IEEE International Conference on Multichip Modules - Denver, CO (April 13-15, 1994)] Proceedings of the International Conference on Multichip Modules - 3-D Stacking Using the GE High Density Multichip Module Technology

[IEEE International Conference on Multichip Modules - Denver, CO (April 13-15, 1994)] Proceedings of the International Conference on Multichip Modules - 3-D Stacking Using the GE High Density Multichip Module Technology

Saia, R.J.; Wojnarowski, R.J.; Fillion, R.A.; Forman, G.A.; Gorowitz, B.

作者Saia, R.J.; Wojnarowski, R.J.; Fillion, R.A.; Forman, G.A.; Gorowitz, B.
文件大小661.51KB
发表时间1994
DOI10.1109/icmcm.1994.753564
页码285-292

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