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SAE Technical Paper Series [SAE International Aerospace Technology Conference and Exposition -  (OCT. 01, 1994)] SAE Technical Paper Series - Ultra-High Thermal Conductivity Substrate for Electronic Components

SAE Technical Paper Series [SAE International Aerospace Technology Conference and Exposition - (OCT. 01, 1994)] SAE Technical Paper Series - Ultra-High Thermal Conductivity Substrate for Electronic Components

Lake, Max L.; Ting, Jyh-Ming; Jacobsen, Ronald L.; Lagounov, Alexandre G.; Gottschlich, Joseph M.
  • 作者Lake, Max L.; Ting, Jyh-Ming; Jacobsen, Ronald L.; Lagounov, Alexandre G.; Gottschlich, Joseph M.
  • 卷第1卷
  • 印刷ISSNArra-y
  • 文件大小1914.71KB
  • 发表时间1994
  • DOI10.4271/942186
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