![[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire material]()
[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire materialPremkumar, Jeromerajan; Gopinath, Maasi; Meng Yong Shie, ; Gary-TS Tay, · 2011