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Special Issue. Recent and Future Trends of Surface Mount Technology for Electronics Component. Trends of Mounting Technology and Bonding Technology.

Special Issue. Recent and Future Trends of Surface Mount Technology for Electronics Component. Trends of Mounting Technology and Bonding Technology.

HATADA, Kenzo
  • 期刊名称Journal of the Surface Finishing Society of Japan
  • 作者HATADA, Kenzo
  • 卷第46卷
  • 期第3期
  • 印刷ISSN0915-1869
  • 电子ISSN1884-3409
  • 文件大小852.82KB
  • 发表时间1995
  • DOI10.4139/sfj.46.223
  • 页码223-229
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