Services linked to intermodal transportation
- 作者Brian Slack
- 卷第75卷
- 期第3期
- 印刷ISSN1056-8190
- 电子ISSN1435-5957
- 文件大小673.63KB
- 发表时间1996-07
- DOI10.1007/bf02406754
- 页码253-263
[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Investigation of interfacial reactions in the Sn/Fe-xNi coupleYen, Yee-Wen; Chen, Bo-Jyun; Li, Yi-Shan · 2013
[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) coupleChang, Jing-Shiun; Yen, Yee-Wen · 2018