Addendum to “fatigue crack propagation life analysis of solder joints under thermal cyclic loading” [Theoretical and applied fracture mechanics 24 (1996) 157–164]

• 作者R.M.V. Pidaparti; X. Song
• 卷第25卷
• 期第1期
• 印刷ISSN0167-8442
• 文件大小37.63KB
• 发表时间1996
• DOI10.1016/0167-8442(96)00010-9