Effect of copper on the microstructure and electromigration lifetime of Ti–AlCu–Ti fine lines in the presence of tungsten diffusion barriers

• 期刊名称Journal of Applied Physics
• 作者Domenicucci, A. G.; Filippi, R. G.; Choi, K. W.; Hu, C.-K.; Rodbell, K. P.
• 卷第80卷
• 期第9期
• 印刷ISSN0021-8979
• 文件大小761.06KB
• 发表时间1996
• DOI10.1063/1.363539