[IEEE 1st International Symposium on Plasma Process-Induced Damage - Santa Clara, CA (13-14 May 1996)] Proceedings of 1st International Symposium on Plasma Process-Induced Damage - Analytical Circuit Model Approach to Charging Damage in Plasma/implantation Processing
- 作者En, W.G.; Shich, B.P.; Cheung, N.W.
- 文件大小342.59KB
- 发表时间1996
- DOI10.1109/ppid.1996.715206
- 页码77-80
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