[IEEE 1997 21st International Conference on Microelectronics. Proceedings - Nis, Yugoslavia (14-17 Sept. 1997)] 1997 21st International Conference on Microelectronics. Proceedings - 2D modelling of mechanical stress evolution and electromigration in confined aluminum interconnects
Petrescu, V.; Mouthaan, A.J.
- 作者Petrescu, V.; Mouthaan, A.J.
- 卷第2卷
- 文件大小392.09KB
- 发表时间1997
- DOI10.1109/icmel.1997.632920
- 页码629-632