[IEEE SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest - Cambridge, MA, USA (8-10 Sept. 1997)] SISPAD '97. 1997 International Conference on Simulation of Semiconductor Processes and Devices. Technical Digest - Mechanical stress modeling for silicon fabrication processes
- 作者Rueda, H.A.; Cea, S.; Law, M.E.
- 文件大小276.80KB
- 发表时间1997
- DOI10.1109/sispad.1997.621334
- 页码53-55
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