[IEEE Comput. Soc. Press 1997 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA (4-5 Feb. 1997)] Proceedings 1997 IEEE Multi-Chip Module Conference - Prototype development of flip chip MCMs
Hansford, W.; Peltier, J.; Franzon, P.; Lipa, S.; Schaeffer, J.
- 作者Hansford, W.; Peltier, J.; Franzon, P.; Lipa, S.; Schaeffer, J.
- 文件大小254.73KB
- 发表时间1997
- DOI10.1109/mcmc.1997.569358
- 页码133-135