[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Investigation of heat sink attach methodologies and the effects on package structural integrity and interconnect reliability of the 119-lead plastic ball grid array
- 作者Eyman, L.M.; Kromann, G.B.
- 文件大小930.14KB
- 发表时间1997
- DOI10.1109/ECTC.1997.606302
- 页码1068-1075
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