A low temperature interconnection method for electronics assembly
- 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- 作者Kulojarvi, K.; Kivilahti, J.K.
- 卷第21卷
- 期第2期
- 印刷ISSN1070-9886
- 文件大小353.32KB
- 发表时间1998-6
- DOI10.1109/95.705477
- 页码288-291
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