发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Comparison of barrier materials and deposition processes for copper integration

[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Comparison of barrier materials and deposition processes for copper integration

Moussavi, M.; Gobil, Y.; Ulmer, L.; Perroud, L.; Motte, P.; Torres, J.; Romagna, F.; Fayolle, M.; Palleau, J.; Plissonier, M.
  • 作者Moussavi, M.; Gobil, Y.; Ulmer, L.; Perroud, L.; Motte, P.; Torres, J.; Romagna, F.; Fayolle, M.; Palleau, J.; Plissonier, M.
  • 文件大小729.16KB
  • 发表时间1998
  • DOI10.1109/iitc.1998.704928
  • 页码295-297
同标题推荐
← 返回【学霸图书馆】主页
© 2026 学霸图书馆 · 让阅读成为习惯