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[IEEE 1998 Symposium on VLSI Technology Digest of Technical Papers - Honolulu, HI, USA (9-11 June 1998)] 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) - Electromigration of submicron Damascene copper interconnects

[IEEE 1998 Symposium on VLSI Technology Digest of Technical Papers - Honolulu, HI, USA (9-11 June 1998)] 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216) - Electromigration of submicron Damascene copper interconnects

Changsup Ryu, ; Kee-Won Kwon, ; Loke, A.L.S.; Dubin, V.M.; Kavari, R.A.; Ray, G.W.; Wong, S.S.
  • 作者Changsup Ryu, ; Kee-Won Kwon, ; Loke, A.L.S.; Dubin, V.M.; Kavari, R.A.; Ray, G.W.; Wong, S.S.
  • 文件大小355.90KB
  • 发表时间1998
  • DOI10.1109/vlsit.1998.689238
  • 页码156-157
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