[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Lifetime and damage assessment for CSPs and related microelectronic structures: experimental validation plus computer modeling
Albrecht, J.-J.; Birzer, Ch.; Muller, W.H.; Jendrny, J.; Pape, H.; Schwarz, B.; Teichmann, H.; Tilgner, R.
- 作者Albrecht, J.-J.; Birzer, Ch.; Muller, W.H.; Jendrny, J.; Pape, H.; Schwarz, B.; Teichmann, H.; Tilgner, R.
- 文件大小850.60KB
- 发表时间1998
- DOI10.1109/eptc.1998.755998
- 页码177-183