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Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors

Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors

Gerke, R.D.; Kromann, G.B.
  • 期刊名称IEEE Transactions on Components and Packaging Technologies
  • 作者Gerke, R.D.; Kromann, G.B.
  • 卷第22卷
  • 期第4期
  • 印刷ISSN1521-3331
  • 文件大小321.03KB
  • 发表时间1999
  • DOI10.1109/6144.814963
  • 页码488-496
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