[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Novel flip chip underfills
Chau, M.M.; Ho, B.; Herrington, T.; Bowen, J.
- 作者Chau, M.M.; Ho, B.; Herrington, T.; Bowen, J.
- 文件大小607.50KB
- 发表时间1999
- DOI10.1109/ectc.1999.776303
- 页码967-974