![[IEEE Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting - St. Louis, MO, USA (12-15 Oct. 1998)] Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) - Fundamental characteristics of electrostatic wafer chuck with insulating sealant]()
[IEEE Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting - St. Louis, MO, USA (12-15 Oct. 1998)] Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) - Fundamental characteristics of electrostatic wafer chuck with insulating sealantYatsuzuka, K.; Hatakeyama, F.; Asano, K.; Aonuma, S. · 1998