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[IEEE 13th Annual IEEE International ASIC/SOC Conference - Arlington, VA, USA (13-16 Sept. 2000)] Proceedings of 13th Annual IEEE International ASIC/SOC Conference (Cat. No.00TH8541) - Design of low-capacitance bond pad for high-frequency I/O applications in CMOS integrated circuits

[IEEE 13th Annual IEEE International ASIC/SOC Conference - Arlington, VA, USA (13-16 Sept. 2000)] Proceedings of 13th Annual IEEE International ASIC/SOC Conference (Cat. No.00TH8541) - Design of low-capacitance bond pad for high-frequency I/O applications in CMOS integrated circuits

Ming-Dou Ker, ; Hsin-Chin Jiang, ; Chyh-Yih Chang,

作者Ming-Dou Ker, ; Hsin-Chin Jiang, ; Chyh-Yih Chang,
文件大小532.01KB
发表时间2000
DOI10.1109/ASIC.2000.880752
页码293-296

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