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RF interconnect for multi-gbit/s board-level clock distribution

Woonghwan Ryu, ; Junwoo Lee, ; Hyungsoo Kim, ; Seungyoung Ahn, ; Namhoon Kim, ; Baekkyu Choi, ; Donggun Kam, ; Joungho Kim,

期刊名称IEEE Transactions on Advanced Packaging
作者Woonghwan Ryu, ; Junwoo Lee, ; Hyungsoo Kim, ; Seungyoung Ahn, ; Namhoon Kim, ; Baekkyu Choi, ; Donggun Kam, ; Joungho Kim,
卷第23卷
期第3期
印刷ISSN1521-3323
文件大小650.52KB
发表时间2000
DOI10.1109/6040.861553
页码398-407