SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Design, Modeling, and Simulation in Microelectronics - Microcoil modeling: benefit and implementation of a permeable layer
- 作者Rehfuss, Sven; Marschner, Claudia; Peters, Dagmar; Bolte, Hilmar; Laur, Rainer; Courtois, Bernard; Demidenko, Serge N.; Lau, Lee Y.
- 卷第4228卷
- 印刷ISSN0277-786X
- 文件大小280.59KB
- 发表时间2000
- DOI10.1117/12.405437
- 页码33-43
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