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[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Modeling of interconnects and electromagnetic field distributions using FDTD method

[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Modeling of interconnects and electromagnetic field distributions using FDTD method

Watanabe, T.; Suzuki, M.; Kamo, A.; Asai, H.

作者Watanabe, T.; Suzuki, M.; Kamo, A.; Asai, H.
文件大小430.06KB
发表时间2001
DOI10.1109/EPEP.2001.967638
页码169-172

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