Interface induced uphill diffusion of boron: an effective approach for ultrashallow junction
- 期刊名称IEEE Electron Device Letters
- 作者Howard Chih-Hao Wang, ; Chih-Chiang Wang, ; Chih-Sheng Chang, ; Tahui Wang, ; Griffin, P.B.; Diaz, C.H.
- 卷第22卷
- 期第2期
- 印刷ISSN0741-3106
- 电子ISSN1558-0563
- 文件大小46.42KB
- 发表时间2001-02
- DOI10.1109/55.902833
- 页码65-67
[IEEE 2006 8th International Conference on Actual Problems of Electronic Instrument Engineering - Novosibirsk, Russia (2006.09.26-2006.09.28)] 2006 8th International Conference on Actual Problems of Electronic Instrument Engineering - 2006 8th International Conference on Actual Problems of Electronic Instrument Engineering Proceedings2006
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[IEEE 2006 8th International Conference on Actual Problems of Electronic Instrument Engineering - Novosibirsk, Russia (2006.09.26-2006.09.28)] 2006 8th International Conference on Actual Problems of Electronic Instrument Engineering - 2006 8th International Conference on Actual Problems of Electronic Instrument Engineering Proceedings2006
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