Modeling differential via holes
- 期刊名称IEEE Transactions on Advanced Packaging
- 作者Laermans, E.; De Geest, J.; De Zutter, D.; Olyslager, F.; Sercu, S.; Morlion, D.
- 卷第24卷
- 期第3期
- 印刷ISSN1521-3323
- 文件大小129.99KB
- 发表时间2001
- DOI10.1109/6040.938303
- 页码357-363
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