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Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps

Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps

MUKAI, Minoru; TAKAHASHI, Hiroyuki; KAWAKAMI, Takashi; TAKAHASHI, Kuniaki; IWASAKI, Ken; KISHIMOTO, Kikuo; SHIBUYA, Toshikazu
  • 期刊名称JSME International Journal Series A
  • 作者MUKAI, Minoru; TAKAHASHI, Hiroyuki; KAWAKAMI, Takashi; TAKAHASHI, Kuniaki; IWASAKI, Ken; KISHIMOTO, Kikuo; SHIBUYA, Toshikazu
  • 卷第44卷
  • 期第4期
  • 印刷ISSN1344-7912
  • 电子ISSN1347-5363
  • 文件大小1491.60KB
  • 发表时间2001
  • DOI10.1299/jsmea.44.567
  • 页码567-572
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