Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps
MUKAI, Minoru; TAKAHASHI, Hiroyuki; KAWAKAMI, Takashi; TAKAHASHI, Kuniaki; IWASAKI, Ken; KISHIMOTO, Kikuo; SHIBUYA, Toshikazu
- 期刊名称JSME International Journal Series A
- 作者MUKAI, Minoru; TAKAHASHI, Hiroyuki; KAWAKAMI, Takashi; TAKAHASHI, Kuniaki; IWASAKI, Ken; KISHIMOTO, Kikuo; SHIBUYA, Toshikazu
- 卷第44卷
- 期第4期
- 印刷ISSN1344-7912
- 电子ISSN1347-5363
- 文件大小1491.60KB
- 发表时间2001
- DOI10.1299/jsmea.44.567
- 页码567-572