High temperature lead-free solder for microelectronics
- 作者Frank W. Gayle; Gary Becka; Ahmer Syed; Jerry Badgett; Gordon Whitten; Tsung-Yu Pan; Angela Grusd; Brian Bauer; Rick Lathrop; Jim Slattery; Iver Anderson; Jim Foley; Alan Gickler; Duane Napp; John Mather; Chris Olson
- 卷第53卷
- 期第6期
- 印刷ISSN1047-4838
- 电子ISSN1543-1851
- 文件大小169.39KB
- 发表时间2001
- DOI10.1007/s11837-001-0097-5
- 页码17-21
A case of congenital infantile digital fibromatosisS. K. Kang; S. E. Chang; J. H. Choi; K. J. Sung; K. C. Moon; J. K. Koh · 2002
ForewordSung K. Kang; Iver Anderson; Srini Chada; Jeng-Gong Duh; Laura J. Turbini; Albert Wu; C. Robert Kao; Fay Hua; K. N. Subramanian; Darrel Frear; Carol Handwerker; Fu Guo; Nik Chawla; Kejun Zeng · 2009
Lead (Pb)-free solders for electronic packagingSung K. Kang; Amit K. Sarkhel · 1994
Development of automotive engine cradle by hydroforming processK. J. Kim; J. S. Kim; B. I. Choi; K. H. Kim; H. H. Choi; C. W. Kim; K. W. Kang; J. H. Song; C. W. Sung · 2007
ForewordSung K. Kang; Hareesh Mavoori; Srinivas Chada; C. Robert Kao; Ronald W. Smith · 2001
ForewordSrinivas Chada; Darrel Frear; Sungho Jin; Sung K. Kang; C. Robert Kao; Martin Weiser · 2002
ForewordJames P. Lucas; Srini Chada; Sung K. Kang; C. Robert Kao; Kwang-Lung Lin; Jud Ready; Jin Yu · 2003
ForewordSrinivas Chada; Laura J. Turbini; Sung K. Kang; Kwang-Lung Lin; Michael R. Notis; Jin Yu · 2004