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[Japan Soc. Appl. Phys 2002 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2002) - Kobe, Japan (4-6 Sept. 2002)] International Conferencre on Simulation of Semiconductor Processes and Devices - Enhanced advancing front Delaunay meshing in TCAD

[Japan Soc. Appl. Phys 2002 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2002) - Kobe, Japan (4-6 Sept. 2002)] International Conferencre on Simulation of Semiconductor Processes and Devices - Enhanced advancing front Delaunay meshing in TCAD

Fleischmann, P.; Selberherr, S.
  • 作者Fleischmann, P.; Selberherr, S.
  • 文件大小382.04KB
  • 发表时间2002
  • DOI10.1109/SISPAD.2002.1034526
  • 页码99-102
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