Effect of the Tantalum Barrier Layer on the Electromigration and Stress Migration Resistance of Physical-Vapor-Deposited Copper Interconnect
- 期刊名称Japanese Journal of Applied Physics
- 作者Chin, Yu-Lung; Chiou, Bi-Shiou; Wu, Wen-Fa
- 卷第41卷
- 印刷ISSN0021-4922
- 电子ISSN1347-4065
- 文件大小660.28KB
- 发表时间2002-5-15
- DOI10.1143/JJAP.41.3057
- 页码3057-3064
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Inside Front Cover (Aims & Scope, Editors)Advanced Powder Technology · 2013
Full title (Editorial Board Members)Advanced Powder Technology · 2013
Full title (Editorial Board Members)Advanced Powder Technology · 2013
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Inside Front Cover (Aims & Scope, Editors)Advanced Powder Technology · 2014
Inside Front Cover (Aims &Scope, Editors)Advanced Powder Technology · 2014