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[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - The design and fabrication techniques of multilayer substrate for MCM-C

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - The design and fabrication techniques of multilayer substrate for MCM-C

Huang Jinsheng, ; Zhao Ping, ; Zou Yongming, ; Fu Hualiang, ; Zheng Hongyu, ; Gao Shangtong,
  • 作者Huang Jinsheng, ; Zhao Ping, ; Zou Yongming, ; Fu Hualiang, ; Zheng Hongyu, ; Gao Shangtong,
  • 文件大小281.65KB
  • 发表时间2003
  • DOI10.1109/eptc.2003.1298700
  • 页码96-100
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