发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Design and fabrication of an IC encapsulation mold adhesion force tester [Abstracts of Forthcoming Manuscripts]

Design and fabrication of an IC encapsulation mold adhesion force tester [Abstracts of Forthcoming Manuscripts]

Shyang-Jye Chang, ; Sheng-Jye Hwang,
  • 期刊名称IEEE Transactions on Electronics Packaging Manufacturing
  • 作者Shyang-Jye Chang, ; Sheng-Jye Hwang,
  • 卷第26卷
  • 期第4期
  • 印刷ISSN1521-334X
  • 文件大小145.31KB
  • 发表时间2003-10
  • DOI10.1109/tepm.2003.823165
  • 页码264-264
← 返回【学霸图书馆】主页