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Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process

Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process

C.F. Tsang; V.N. Bliznetsov; Y.J. Su

作者C.F. Tsang; V.N. Bliznetsov; Y.J. Su
卷第34卷
期第11期
印刷ISSN0026-2692
文件大小548.17KB
发表时间2003
DOI10.1016/j.mejo.2003.09.005
页码1051-1058

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